Visual Inspection Technology in the Hard Disk Drive Industry by Muneesawang Paisarn & Yammen Suchart

Author:Muneesawang , Paisarn & Yammen , Suchart
Language: eng
Format: epub
ISBN: 9781119058731
Publisher: Wiley
Published: 2015-03-23T04:00:00+00:00

Figure 5.4. a) Dimension of the IC die package used in the current work and b) free body diagram of solder ball with axial-symmetric discussed in [LIU 03]

Since the system in the reflow machine is in open air conditions, pressure equals 0. Therefore, equation [5.1] can be expressed as:

[5.2]

where θh is the degree, Fh is the weight of the component or force (N), γ is the surface tension (N/m) and R is the radius ( μm).

The analysis of the change of bump shape will be investigated in two patterns. These are discussed in the following sections.

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